Transparent PCB and method for manufacturing the same

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United States of America Patent

PATENT NO 11134564
SERIAL NO

17036544

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A transparent PCB includes a transparent base film, a hardened layer, an electrode film, a first conductive paste, a second conductive paste, and an electronic component. The hardened layer is formed on a side of the transparent base film. The electrode film is formed on a side of the hardened layer. The electrode film includes a first transparent conductive oxide layer, a metal layer, and a second transparent conductive oxide layer. The first conductive paste is formed on the electrode film. The second conductive paste is formed on the electrode film and spaced from the first conductive paste. The electronic component is electrically connected to the electrode film through the first conductive paste and the second conductive paste. The present invention also needs to provide a method for manufacturing the transparent PCB.

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Patent Owner(s)

Patent OwnerAddress
AVARY HOLDING (SHENZHEN) CO LIMITED27TH FLOOR BLOCK A AVARY TIME CENTER NO 2038 HAIXIU ROAD HAIBIN COMMUNITY XIN AN STREET SHENZHEN
QING DING PRECISION ELECTRONICS (HUAIAN) CO LTDNO 8 PENGDING ROAD HUAI AN CITY JIANGSU PROVINCE CHINA HUAI AN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ho, Ming-Jaan New Taipei, TW 86 92
Hsu, Hsiao-Ting New Taipei, TW 31 10
Liu, Li-Kun Shenzhen, CN 13 5
Shen, Fu-Yun Shenzhen, CN 49 54

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