Non-eutectic bonding

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United States of America Patent

PATENT NO 11141810
APP PUB NO 20170282287A1
SERIAL NO

15475153

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Abstract

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The present invention relates to a method of forming a joint bonding together two solid objects and joints made by the method, where the joint is formed by a layer of a binary system which upon heat treatment forms a porous, coherent and continuous single solid-solution phase extending across a bonding layer of the joint.

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Patent Owner(s)

Patent OwnerAddress
TECHNI HOLDING AS3184 BORRE

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Larsson, Andreas Lier, NO 46 162
Tollefsen, Torleif A Drammen, NO 5 12

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