Surface treated copper foil

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United States of America Patent

PATENT NO 11145867
APP PUB NO 20200248330A1
SERIAL NO

16654723

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Abstract

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Surface-treated copper foils exhibiting a void volume (Vv) in a range of 0.4 to 2.2 μm3/μm2 and an arithmetic mean waviness (Wa) lower than or equal to 0.4 μm are reported. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.

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Patent Owner(s)

Patent OwnerAddress
CHANG CHUN PETROCHEMICAL CO LTD7F NO 301 SONGJIANG RD TAIPEI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chou, Jui-Chang Taipei, TW 42 76
Lai, Chien-Ming Taipei, TW 62 545
Lai, Yao-Sheng Taipei, TW 43 65

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