Stacked electronic component and method for manufacturing stacked electronic component
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United States of America Patent
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Oct 19, 2021
Grant Date -
N/A
app pub date -
Nov 14, 2019
filing date -
May 15, 2017
priority date (Note) -
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Abstract
Provided is a stacked electronic component having: a stacked body 1 in which ceramic layers 1a to 1h are stacked, the stacked body having an a upper surface U and side surfaces S; at least one recess portion 8 formed on the upper surface U that indicates at least one of a mark, a letter, or a number; electrodes 3, 4, 5, 6 formed between the layers of the stacked body 1; and a shield layer 9 formed on the upper surface U and the side surfaces S of the stacked body 1. Right below an inner bottom surface of the recess portion 8 of the stacked body 1, there is provided a no-electrode region NE in which the electrodes 3, 4, 5, 6 are not formed, the no-electrode region NE having a thickness which is equal to or larger than a depth of the recess portion 8.
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