Manufacturing method for electronic component including electrode formed by removal of insulating layer by laser light
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 9, 2021
Grant Date -
Nov 9, 2017
app pub date -
Jul 27, 2017
filing date -
Jan 30, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A manufacturing method for an electronic component includes: a step of forming an insulating layer on an outer electrode body so as to cover the outer electrode body, the outer electrode body being formed on a chip element which forms the electronic component; and a step of removing the insulating layer in a predetermined region of the outer electrode body by applying laser light to the insulating layer in the predetermined region so as to expose the predetermined region. The insulating layer has a higher absorption coefficient for the laser light than a material forming a surface of the outer electrode body.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully