Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11179822
APP PUB NO 20200215661A1
SERIAL NO

16642008

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A polishing pad, a polyurethane polishing layer and a preparation method thereof are provided, belonging to the technical field of polishing in chemical-mechanical planarization treatment. The polyurethane polishing layer having a coefficient of thermal expansion of 100-200 ppm/° C. comprises a reaction product produced by reacting of multiple components. The multiple components include an isocyanate-terminated prepolymer, a hollow microsphere polymer and a curing agent composition. The curing agent composition includes 5-55 wt % of an aliphatic diamine composition, 0-8 wt % of a polyamine composition and 40-90 wt % of an aromatic bifunctional composition. The polyurethane polishing layer has a density of 0.6-1.1 g/cm3, a Shore hardness of 45-70D and an elongation at break of 50-450%. The polyurethane polishing layer is prepared by a simple process with low cost and energy consumption. The polyurethane polishing layer prepared by the process has a high hydrolytic stability, a uniform density and a stable removal rate.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
HUBEI DINGHUI MICROELECTRONICS MATERIALS CO LTD430057 ROOM 411 NO 1 DONGJINGHE ROAD WUHAN ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE HUBEI PROVINCE WUHAN CITY HUBEI PROVINCE 430057

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Che, Liyuan Wuhan, CN 2 2
Liu, Min Wuhan, CN 296 2713
Luo, Yijie Wuhan, CN 1 2
Zhang, Jiping Wuhan, CN 41 219
Zhu, Shunquan Wuhan, CN 8 6

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 May 23, 2025
7.5 Year Payment $3600.00 $1800.00 $900.00 May 23, 2029
11.5 Year Payment $7400.00 $3700.00 $1850.00 May 23, 2033
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00