Electrically conductive adhesive film and dicing-die bonding film using the same

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United States of America Patent

PATENT NO 11193047
APP PUB NO 20190016929A1
SERIAL NO

16056896

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Abstract

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The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 μm or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

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Patent Owner(s)

Patent OwnerAddress
FURUKAWA ELECTRIC CO LTDCHIYODA-KU TOKYO 100-8322

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kirikae, Noriyuki Tokyo, JP 17 90
Mihara, Naoaki Tokyo, JP 16 75
Sugiyama, Jirou Tokyo, JP 10 66

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