Thermal processing of closed shape workpieces

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United States of America Patent

PATENT NO 11193178
APP PUB NO 20190127818A1
SERIAL NO

16059148

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Abstract

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Systems and methods for heat treating closed shape workpieces are provided. In one example implementation, a method can include imparting relative motion of the closed shape workpiece such that the perimeter surface of the closed shape workpiece is moved relative to the lamp heat source from a first position where a first portion of the closed shape workpiece is presented to the lamp heat source to a second position where a second portion of the closed shape workpiece is presented to the lamp heat source. The method can include emitting lamp heat onto the perimeter surface of the closed shape workpiece from the lamp heat source during imparting of relative motion of the closed shape workpiece. The method can include implementing a flux control procedure during emitting of lamp heat onto the perimeter surface of the closed shape workpiece.

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Patent Owner(s)

Patent OwnerAddress
MATTSON TECHNOLOGY INC47131 BAYSIDE PARKWAY FREMONT CA 94538
BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO LTDNO 8 BUILDING NO 28 JINGHAI ER RD ECONOMIC AND TECHNICAL DEVELOPMENT ZONE BEIJING 100176

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bremensdorfer, Rolf Bibertal, DE 26 18
Keppler, Johannes Dornstadt, DE 5 0
Yang, Michael Palo Alto, US 143 5380

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