Method of manufacturing sputtering target and sputtering target

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11198933
APP PUB NO 20200115790A1
SERIAL NO

16713957

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBAMINATO-KU TOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Komatsu, Tooru Kanagawa, JP 3 0
Nakashima, Nobuaki Kanagawa, JP 18 54

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Jun 14, 2025
7.5 Year Payment $3600.00 $1800.00 $900.00 Jun 14, 2029
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jun 14, 2033
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00