Electrically conductive adhesive film and dicing-die bonding film using the same

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United States of America

PATENT NO 11230649
APP PUB NO 20180346767A1
SERIAL NO

16056910

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Abstract

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The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250° C. under a nitrogen atmosphere of less than 1%.

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Patent Owner(s)

Patent OwnerAddress
FURUKAWA ELECTRIC CO LTDTOKYO 100-8322

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kirikae, Noriyuki Tokyo, JP 17 90
Mihara, Naoaki Tokyo, JP 16 75
Sugiyama, Jirou Tokyo, JP 10 66

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