Heat dissipation module and electronic device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11232997
APP PUB NO 20210057306A1
SERIAL NO

16681847

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat dissipation module including a heat dissipation portion, a working fluid, and a buffer member is provided. The heat dissipation portion has a containing portion, the working fluid is contained in the containing portion, and the buffer member is connected to the containing portion. When the working fluid is heated, the buffer member is expanded to maintain a constant pressure within the containing portion.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
WISTRON CORPORATIONNEW TAIPEI CITY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wu, Huan-Chun New Taipei, TW 4 4

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