Soldering apparatus and method for creating program

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11273510
APP PUB NO 20190099819A1
SERIAL NO

16143011

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The present application discloses a soldering apparatus including a soldering iron having an iron tip that melts solder, a driving portion that moves the soldering iron, and an operation portion displaced to instruct the driving portion of a moving direction of the soldering iron. While an operation on the operation portion is performed by a user, the driving portion moves the soldering iron in a direction corresponding to a displacement direction of the operation portion.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
HAKKO CORPORATIONOSAKA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takahara, Tomoo Osaka, JP 70 941
Teraoka, Yoshitomo Osaka, JP 35 258

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