Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11274234
APP PUB NO 20190276712A1
SERIAL NO

16297394

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Abstract

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Disclosed is an adhesive composition for temporarily bonding a semiconductor workpiece and support carrier pair with improved adhesive film properties. The adhesive composition may include one or more polymer resins, solvents, and a small but critical quantity of surfactants, among others. In operation, the one or more surfactants may improve film continuity, leveling, and reduce voids and defects. Sample semiconductor workpiece includes a semiconductor silicon wafer and sample support carrier includes rigid semiconductor silicon or glass, sapphire or other rigid materials.

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Patent Owner(s)

Patent OwnerAddress
CHENGDU ESWIN SYSTEM IC CO LTDNO 12 SHANGYANG ST HIGH TECH DISTRICT WEST CHENGDU CITY 611731

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hu, Yijiang San Jose, US 2 3
Shen, Minghao San Jose, US 27 89
Zhang, Chunbin San Jose, US 15 260
Zhou, Xiaotian San Jose, US 18 41
Zou, Shaolin San Jose, US 2 3

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