Microelectronic assemblies having substrate-integrated perovskite layers

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11302618
APP PUB NO 20190311980A1
SERIAL NO

15948803

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Abstract

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Disclosed herein are microelectronic assemblies with integrated perovskite layers, and related devices and methods. For example, in some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, and a perovskite conductive layer on the conductive layer. In some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, a perovskite conductive layer having a first crystalline structure on the conductive layer, and a perovskite dielectric layer having a second crystalline structure on the perovskite conductive layer. In some embodiments, the first and second crystalline structures have a same orientation.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eid, Feras Chandler, US 299 1201
Liff, Shawna M Scottsdale, US 214 1581
Sounart, Thomas Chandler, US 26 23
Swan, Johanna M Scottsdale, US 282 2442

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