Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the same

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United States of America

PATENT NO 11306225
APP PUB NO 20180346768A1
SERIAL NO

16056932

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Abstract

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The electrically conductive adhesive agent composition comprises a metal particle (Q) and a prescribed organophosphorus compound (A), and the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group.

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Patent Owner(s)

Patent OwnerAddress
FURUKAWA ELECTRIC CO LTD6-4 OTEMACHI 2-CHOME CHIYODA-KU TOKYO 1008322 JAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mihara, Naoaki Tokyo, JP 16 75
Sato, Shunichiro Tokyo, JP 4 33
Sugiyama, Jirou Tokyo, JP 10 66

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