Panel molded electronic assemblies with multi-surface conductive contacts
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United States of America
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May 3, 2022
Grant Date -
N/A
app pub date -
Dec 6, 2019
filing date -
Dec 6, 2019
priority date (Note) -
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status (Latency Note)
Importance
Abstract
Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.
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