Surface treated copper foil, copper clad laminate, and printed circuit board

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United States of America Patent

PATENT NO 11337315
APP PUB NO 20210337664A1
SERIAL NO

16498032

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has L* of a CIE L*a*b* color space of 44.0 to 84.0. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to a surface of the surface treated copper foil 1 opposite to the first surface treatment layer 3.

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Patent Owner(s)

  • JX NIPPON MINING & METALS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miki, Atsushi Ibaraki, JP 78 1365
Miyamoto, Nobuaki Ibaraki, JP 21 291

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