Bonding wire for semiconductor devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11342299
APP PUB NO 20180374816A1
SERIAL NO

16067120

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present invention has as its object the provision of a bonding wire for semiconductor devices mainly comprised of Ag, in which bonding wire for semiconductor devices, the bond reliability demanded for high density mounting is secured and simultaneously a sufficient, stable bond strength is realized at a ball bond, no neck damage occurs even in a low loop, the leaning characteristic is excellent, and the FAB shape is excellent. To solve this problem, the bonding wire for semiconductor devices according to the present invention contains one or more of Be, B, P, Ca, Y, La, and Ce in a total of 0.031 at % to obtain a 0.180 at %, further contains one or more of In, Ga, and Cd in a total of 0.05 at % to 5.00 at %, and has a balance of Ag and unavoidable impurities. Due to this, it is possible to obtain a bonding wire for semiconductor devices sufficiently forming an intermetallic compound layer at a ball bond interface to secure the bond strength of the ball bond, not causing neck damage even in a low loop, having a good leaning characteristic, and having a good FAB shape.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
NIPPON STEEL & SUMIKIN MATERIALS CO LTDCHIYODA-KU TOKYO
NIPPON MICROMETAL CORPORATIONIRUMA-SHI SAITAMA 358-0032

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haibara, Teruo Saitama, JP 50 136
Oda, Daizo Saitama, JP 61 213
Ohkabe, Takumi Saitama, JP 3 0
Oyamada, Tetsuya Tokyo, JP 29 29
Uno, Tomohiro Tokyo, JP 109 711
Yamada, Takashi Saitama, JP 581 7758

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Nov 24, 2025
7.5 Year Payment $3600.00 $1800.00 $900.00 Nov 24, 2029
11.5 Year Payment $7400.00 $3700.00 $1850.00 Nov 24, 2033
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00