Method of making printed circuit board and laminated structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11343918
APP PUB NO 20210045250A1
SERIAL NO

16633271

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Abstract

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A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 μm.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTD5-33 KITAHAMA 4-CHOME CHUO-KU OSAKA-SHI OSAKA 541-0041

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imazaki, Eiko Osaka, JP 21 29
Matsuoka, Hideki Osaka, JP 69 489
Nitta, Koji Osaka, JP 166 415
Oka, Yoshio Osaka, JP 54 313
Tanaka, Ippei Osaka, JP 16 21
Uemura, Shigeaki Osaka, JP 6 16
Yonezawa, Takayuki Osaka, JP 23 30

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