Etchant composition

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United States of America Patent

PATENT NO 11345852
APP PUB NO 20210277308A1
SERIAL NO

17261219

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to an etchant composition, in particular to an aqueous masking layer etchant composition for use in the removal of tungsten-doped carbon masking layers from a surface of a substrate, such as a semiconductor wafer. The composition comprises (a) 10 to 40 wt. %, based on the total weight of the composition, of hydrogen peroxide; and (b) 0.1 to 2.0 wt. %, based on the total weight of the composition, of one or more corrosion inhibitors.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH AGSEZ-STRASSE 1 9500 VILLACH 9500

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hecke, Angela Villach, AT 2 0
Lou, David Villach, AT 4 11
Wang, Hongzhi Villach, AT 53 233

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