Ruthenium etching composition and method

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United States of America Patent

PATENT NO 11346008
APP PUB NO 20200190673A1
SERIAL NO

16692834

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Abstract

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The invention provides compositions useful for selectively etching ruthenium and/or copper. The compositions comprise certain periodate compounds, alkylammonium or alkylphosphonium hydroxides, carbonate or bicarbonate buffers, and water, wherein the pH of the composition is about 9 to about 12.5. The compositions of the invention are effectively utilized in the method of the invention and have been found to be capable of etching Cu and Ru at similar rates, i.e., >20 Å/min, while minimizing etch rates of dielectrics (<2 Å/min).

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Patent Owner(s)

Patent OwnerAddress
ENTEGRIS INC129 CONCORD ROAD BILLERICA MA 01821

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cooper, Emanuel I Scarsdale, US 71 1001
Lippy, Steven Brookfield, US 13 325

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