Surface treated copper foil, copper clad laminate, and printed circuit board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11375624
APP PUB NO 20210331449A1
SERIAL NO

16498003

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni deposited amount of 20 to 200 μg/dm2 and a Zn deposited amount of 20 to 1,000 μg/dm2. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

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Patent Owner(s)

  • JX NIPPON MINING & METALS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miki, Atsushi Ibaraki, JP 78 1365
Miyamoto, Nobuaki Ibaraki, JP 21 291

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