Laser cutting of metal-ceramic substrates
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United States of America Patent
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Jul 12, 2022
Grant Date -
Dec 24, 2020
app pub date -
Jun 21, 2018
filing date -
Jun 21, 2017
priority date (Note) -
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Abstract
The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.
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