Dual additive composition for polishing memory hard disks exhibiting edge roll off

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United States of America Patent

PATENT NO 11384253
APP PUB NO 20200224057A1
SERIAL NO

16729905

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Abstract

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The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising colloidal silica, (b) a compound of formula (I), (c) a compound of formula (II), (d) hydrogen peroxide, and (e) water, wherein the polishing composition has a pH of about 1 to about 5. The invention also provides a method of chemically-mechanically polishing a substrate, especially a nickel-phosphorous substrate, by contacting the substrate with the inventive chemical-mechanical polishing composition.

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Patent Owner(s)

Patent OwnerAddress
CMC MATERIALS LLC1209 ORANGE STREET WILMINGTON DE 19801

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Tong Singapore, SG 171 724

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