Removable electronics device for pre-fabricated sensor assemblies

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United States of America Patent

PATENT NO 11392252
APP PUB NO 20210216153A1
SERIAL NO

17215438

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Abstract

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A removable electronics device and related pre-fabricated sensor assemblies having different sensor layouts are provided. The removable electronics module includes one or more processors, an inertial measurement unit, a first communication interface configured to communicatively couple the removable electronics device to one or more computing devices, a second communication interface configured to communicatively couple the removable electronics device to a plurality of pre-fabricated sensor assemblies, and a housing at least partially enclosing the processor, the inertial measurement unit, the first communication interface, and the second communication interface. The housing includes a first opening in at least one longitudinal surface and adjacent to at least a portion of the first communication interface and a plurality of second openings in a lower surface and adjacent to the plurality of contact pads of the second communication interface.

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Patent Owner(s)

Patent OwnerAddress
GOOGLE LLC1600 AMPHITHEATRE PARKWAY MOUNTAIN VIEW CA 94043

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gutierrez, Bravo Mauricio E Santa Clara, US 4 9
Kauffmann, Alejandro San Francisco, US 29 617
Poupyrev, Ivan Sunnyvale, US 163 9734
Sundara-Rajan, Kishore Redwood City, US 81 1019

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