Temperature sensor device
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United States of America Patent
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-
Aug 2, 2022
Grant Date -
Apr 30, 2020
app pub date -
Jun 17, 2019
filing date -
Oct 24, 2018
priority date (Note) -
In Force
status (Latency Note)
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Abstract
To obtain a temperature sensor device having high reliability and high sensitivity without cost increase. This temperature sensor device includes: a housing provided with a temperature sensor module having a temperature detection element and an external connection terminal connected to the temperature detection element via a lead wire, which are integrated using a first formation member made from a thermoplastic resin, the temperature sensor module being covered with a second formation member made from a thermoplastic resin, so as to form a connector for connecting the external connection terminal to an external signal processing circuit; and a case into which the temperature sensor module is press-fitted and which is opposed to the housing, wherein the first formation member and the second formation member are welded to each other.
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