Carbon nanotube enhanced silver paste thermal interface material

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United States of America Patent

PATENT NO 11430711
APP PUB NO 20210159144A1
SERIAL NO

16696105

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Abstract

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A high performance, lead free, Ag paste thermal interface material (TIM) for die attachment and substrate bonding in electronic packaging includes: (i) multiscale silver particles, (ii) metal-coated carbon nanotubes (CNTs), (iii) a polymer, and (iv) a liquid carrier. The multiscale silver particles and metal-coated carbon nanotubes, which function as hybrid filler components, are uniformly dispersed within the TIM composition. The sintered TIM exhibits high density, high mechanical strength, and high thermal conductivity. The components of the liquid carrier including the solvent, binder, surfactants, and thinner are completely evaporated or burned off during sintering. Sintering of the TIM can be conducted at a relatively low temperature, without or with very low (<0.1 MPa) pressure, in open air and without vacuum or inert gas protection. The TIM can be utilized in substrate bonding not only on conventional metal-plated surfaces but also bare Cu substrate surfaces.

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Patent Owner(s)

Patent OwnerAddress
AEGIS TECHNOLOGY INC12630 G WESTMINSTER AVE SANTA ANA CA 92706

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Shuyi Santa Ana, US 19 77
Lin, Zhigang Santa Ana, US 36 245
Tan, Chunhu Santa Ana, US 13 41

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