Method for selectively removing nickel platinum material

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United States of America Patent

PATENT NO 11441229
SERIAL NO

16444262

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Abstract

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A method of selectively removing NiPt material from a microelectronic substrate, the method comprising contacting the NiPt material with an aqueous etching composition comprising:

    an oxidising agent;a strong acid; anda source of chloride.

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Patent Owner(s)

Patent OwnerAddress
ENTEGRIS INC129 CONCORD RD BILLERICA MA 01821

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hong, SeongJin Cheongju-si, KR 15 22

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