High-purity electrolytic copper

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United States of America Patent

PATENT NO 11453953
APP PUB NO 20200173048A1
SERIAL NO

16613209

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Abstract

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The present invention provides a high-purity electrolytic copper 10 having a Cu purity excluding gas components (O, F, S, C, and Cl) is 99.9999 mass % or more, a content of S is 0.1 mass ppm or less, and an area ratio of crystals having a (101)±10° orientation is less than 40%, when crystal orientation is measured by electron backscatter diffraction in a cross section along a thickness direction.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATION2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 100-8117

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Isao Naka, JP 31 309
Kubota, Kenji Naka, JP 70 623
Nakaya, Kiyotaka Naka, JP 36 39
Tarutani, Yoshie Naka, JP 22 34

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