Modular wireless sensing device
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United States of America Patent
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Oct 18, 2022
Grant Date -
May 9, 2019
app pub date -
Aug 30, 2018
filing date -
Aug 12, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure provides a wireless sensing device. In an embodiment, the wireless sensing device includes (A) a button cell. The button cell has a positive electrode and a negative electrode. The device includes (B) a first printed circuit board (IPCB) located on a top surface of the button cell. The IPCB has a first contact and a second contact electrically connected to respective positive electrode and negative electrode of the button cell. The IPCB includes (i) a processor, and (ii) a wireless communication component (WCC). Each of the (i) processor, and (ii) WCC are electrically connected to the IPCB. The device includes (C) a sensor module. The sensor module includes a second PCB (2PCB) and one or more sensor chips electrically connected to the 2PCB. (D) The device has a length from 10 mm to 30 mm, a thickness from 3 mm to 10 mm and a width from 10 mm to 30 mm.
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