Electronic component and manufacturing method for the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11488753
APP PUB NO 20190115127A1
SERIAL NO

16151121

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

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Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTD10-1 HIGASHIKOTARI 1-CHOME NAGAOKAKYO-SHI KYOTO-FU 617-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ida, Isao Nagaokakyo, JP 8 15
Iso, Eiji Nagaokakyo, JP 14 64
Kawachi, Takao Nagaokakyo, JP 8 26
Okuizumi, Hiroshi Nagaokakyo, JP 8 7

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