Liquid metal-based flexible electronic device and preparation method and use thereof

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United States of America Patent

PATENT NO 11490524
SERIAL NO

17513766

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Abstract

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Provided is a liquid metal-based flexible electronic device and a method for preparing a liquid metal-based flexible electronic device, that includes: preparing an Acrylonitrile Butadiene Styrene (ABS) plastic model; performing an ion sputtering on a surface of the ABS plastic model to form a gold film, to obtain a gold-plated ABS circuit; introducing a first silica gel into a mold to suspend the gold-plated ABS circuit inside the mold, and curing the first silica gel to obtain a cured model; immersing the cured model in acetone to dissolve the ABS model, to obtain a microchannel with a gold plating on an inner wall of the microchannel in a first silica gel substrate; and injecting a gallium-indium eutectic, inserting a copper wire, and applying a second silica gel and curing the second silica gel, to obtain the liquid metal-based flexible electronic device.

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Patent Owner(s)

Patent OwnerAddress
HARBIN INSTITUTE OF TECHNOLOGY SHENZHEN518000 HARBIN UNIVERSITY CAMPUS SHENZHEN UNIVERSITY CITY TAOYUAN STREET NANSHAN DISTRICT SHENZHEN CITY GUANGDONG PROVINCE SHENZHEN CITY GUANGDONG PROVINCE 518000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Huanhuan Shenzhen, CN 7 32
Feng, Liang Shenzhen, CN 24 325
Liu, Yaming Shenzhen, CN 8 6
Ma, Xing Shenzhen, CN 10 27
Wang, Li Shenzhen, CN 972 6677
Wang, Min Shenzhen, CN 957 5670
Zhang, Jiaheng Shenzhen, CN 10 12
Zhang, Yueyue Shenzhen, CN 4 31
Zhang, Zhenchao Shenzhen, CN 3 0
Zhao, Weiwei Shenzhen, CN 29 54

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