Method for manufacturing wiring board, and wiring board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11490528
APP PUB NO 20210084774A1
SERIAL NO

17017984

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Abstract

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Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

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Patent Owner(s)

Patent OwnerAddress
TOYOTA JIDOSHA KABUSHIKI KAISHATOYOTA-SHI AICHI-KEN 471-8571

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mori, Rentaro Kasugai, JP 25 115
Okamoto, Kazuaki Toyota, JP 61 183
Yanagimoto, Hiroshi Miyoshi, JP 42 152

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