Etching solution for tungsten word line recess

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United States of America Patent

PATENT NO 11499236
APP PUB NO 20190284704A1
SERIAL NO

16297957

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Abstract

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Described herein is an etching solution suitable for both tungsten-containing metals and TiN-containing materials, which comprises: water; and one or more than one oxidizers; and one or more than one of the components selected from the group consisting of: one or more fluorine-containing-etching compounds, one or more organic solvents, one or more chelating agents, one or more corrosion inhibitors and one or more surfactants.

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Patent Owner(s)

Patent OwnerAddress
VERSUM MATERIALS US LLC8555 SOUTH RIVER PARKWAY PATENT DEPT TEMPE AS 85284

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ge, Jhih Kuei Chupei, TW 8 20
Lee, Yi-Chia Chupei, TW 50 205
Liu, Wen Dar Chupei, TW 41 209

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