Barrier ruthenium chemical mechanical polishing slurry

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United States of America Patent

PATENT NO 11505718
APP PUB NO 20210261822A1
SERIAL NO

17318011

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Abstract

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A slurry for polishing surfaces or substrates that at least partially comprise ruthenium and copper, wherein the slurry includes an alkali hydroxide, oxygenated halogen compound, and a halogen alkyl benzotriazole. The slurry may further include abrasive, acid(s), and, optionally, an alkoxylated alcohol. With these components, the slurry exhibits a high ruthenium to copper removal rate ratio.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM ELECTRONIC MATERIALS U S A INCN KINGSTOWN RI 02852

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hu, Bin Chandler, US 275 1156
Huang, Ting-Kai Taiwan, CN 25 56
Liang, Yannan Gilbert, US 23 6
Lin, David (Tawei) Chandler, US 4 6
Wen, Liqing (Richard) Mesa, US 4 6

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