Method of enhancing copper electroplating

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United States of America Patent

PATENT NO 11512406
SERIAL NO

17026514

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Abstract

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Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

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Patent Owner(s)

Patent OwnerAddress
DUPONT ELECTRONIC MATERIALS INTERNATIONAL LLC455 FOREST STREET MARLBOROUGH MA 01752

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gallagher, Michael K Hopkinton, US 91 1302
Gomez, Luis A Holden, US 5 17
Lachowski, Joseph F Sutton, US 9 48
Lifschitz, Arribio Alejo M Waltham, US 8 4
Prange, Jonathan D Lincoln, US 5 13
Zielinski, Alexander Charlton, US 3 0

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