Substrate
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United States of America Patent
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Dec 13, 2022
Grant Date -
Oct 31, 2019
app pub date -
Apr 23, 2019
filing date -
Apr 26, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate includes a multilayer substrate body in which a plurality of circuit bodies are laminated in a laminating direction through insulating layers and are interlayer connected via a connected conductor formed on each of the insulating layers, and a magnetic body that is arranged in the laminating direction while at least a part of or all of the magnetic body sandwiches the circuit bodies. Each of the circuit bodies includes at least a first circuit body and a second circuit body. The first circuit body is formed of a first extending portion and a first folding portion. The second circuit body is formed of a second extending portion and a second folding portion.
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