Method for improving the wetting of a surface of a solid substrate by a liquid metal

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United States of America Patent

PATENT NO 11525178
APP PUB NO 20210087666A1
SERIAL NO

16346232

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Abstract

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The invention is a method for treating a solid substrate, made from a first material, of metal or ceramic type, the method comprising placing the substrate in contact with a liquid metal, while the substrate is exposed to an ultrasonic wave called a power wave. At the level of a surface of the substrate, the power density is greater than a cavitation threshold of the liquid metal. Such exposure improves the wettability of the substrate surface by the liquid metal.

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Patent Owner(s)

Patent OwnerAddress
CONSTELLIUM ISSOIRE63500 ISSOIRE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Achard, Jean-Louis Vizille, FR 5 4
Taina, Fabio Sassenage, FR 2 0

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