Method for remedying sandy land by using simulated loam substrate spray-seeding technology

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United States of America Patent

PATENT NO 11528857
APP PUB NO 20210219484A1
SERIAL NO

16496172

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Abstract

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A method for remedying sandy land by using a simulated loam substrate spray-seeding technology includes: first, carrying out a sand-fixing treatment to lay a metal mesh in sandy land, the metal mesh being fixed to the surface of the sandy land by a sand-fixing pile; second, spray-seeding a seed into the sandy land by simulated loam substrate spray-seeding; and finally, after spray-seeding, carrying out maintenance management, including adding a protective plate around the metal mesh, covering with a non-woven fabric, watering, fertilizing, reseeding, and post-monitoring. The present invention adopts a two-layer spray-seeding method, and rapidly simulates a loam substrate suitable for plant growth by bionics; the simulated loam substrate having good water retention capacity (conducive to a higher germination rate of seed), root development, microbial activity, nutrient transformation, and plant growth and development. With less investment and having a quick effect, large-scale sand control is provided.

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Patent Owner(s)

Patent OwnerAddress
JIANGSU LVYAN ECOLOGICAL TECHNOLOGY CO LTDSUZHOU JIANGSU 215000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shen, Yifeng Jiangsu, CN 4 1
Zhang, Bo Jiangsu, CN 1006 7322
Zhang, Yuqian Jiangsu, CN 5 1

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