Copper mold for gloves

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United States of America Patent

PATENT NO 11530488
SERIAL NO

17127644

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Abstract

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Methods and processes are described that enable the manufacture of a superior thin-walled mold from which higher-quality, less-costly disposable gloves can be more efficiently produced. The method can include creating a glove form in a sacrificial material; electroforming an electroformed master from the glove form; removing sacrificial material from the electroformed master; creating a tertiary form from the electroformed master; forming an initial copper layering on the tertiary form; and developing the initial copper layering into a thick copper plating to create a copper mold for gloves.

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Patent Owner(s)

Patent OwnerAddress
NEILY RYANPUEBLO CO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Neily, Ryan Pueblo, US 1 0

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