Apparatus for electro-forming and apparatus for horizontal electro-forming
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United States of America Patent
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Dec 20, 2022
Grant Date -
Jul 2, 2020
app pub date -
Dec 30, 2019
filing date -
Dec 31, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is an apparatus for electro-forming. The apparatus for electro-forming includes a plating bath which is a space where a substrate is plated and a clamp disposed within the plating bath and configured to grasp the substrate disposed in a horizontal direction. The apparatus for electro-forming further includes an assembly including an anode spaced above the substrate and connected to an external power supply and a plating solution supply unit spaced above the substrate and configured to supply a plating solution. The apparatus for electro-forming also includes a driving unit configured to reciprocate the assembly in a horizontal direction at a distance from the substrate. The assembly further includes an insulator between the anode and the plating solution supply unit.
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