Multi-die module with contactless coupler and a coupling loss reduction structure

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United States of America Patent

PATENT NO 11545466
APP PUB NO 20210143130A1
SERIAL NO

17150825

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Abstract

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A multi-die module includes a first die with a first electronic device and a second die with a second electronic device. The multi-die module also includes a contactless coupler configured to convey signals between the first electronic device and the second electronic device. The multi-die module also includes a coupling loss reduction structure.

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Patent Owner(s)

Patent OwnerAddress
TEXAS INSTRUMENTS INCORPORATEDDALLAS TX

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bahr, Bichoy Allen, US 60 97
Cook, Benjamin Stassen Addison, US 175 892
Haroun, Baher Allen, US 119 2639

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