Solution-based deposition method for preparing semiconducting thin films via dispersed particle self-assembly at a liquid-liquid interface

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United States of America Patent

PATENT NO 11551928
APP PUB NO 20210313177A1
SERIAL NO

17265420

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Abstract

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A method for preparing a semiconducting thin film and device for carrying out the method, wherein the method includes: (1) providing a liquid-liquid interface; (2) providing at least one layered semiconductor material or its precursor(s) in the form of particles in a solvent in the form of a dispersion; (3) injecting the dispersion at the liquid-liquid interface, in order to obtain an assembly of semiconductor/semiconductor precursor particles; (4) bringing the assembly of into contact with a flexible substrate; and (5) applying a surface pressure to the dispersion to obtain a particle film of semiconductor/semiconductor precursor on the substrate, wherein the first solvent has a higher density than the second solvent.

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Patent Owner(s)

Patent OwnerAddress
TOYOTA JIDOSHA KABUSHIKI KAISHATOYOTA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Johnson, Hannah Brussels, BE 8 1
Kinge, Sachin Brussels, BE 12 27
Sivula, Kevin Lausanne, CH 3 0
Wells, Rebekah Anne Lausanne, CH 2 0

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