Systems and methods for removing an adhesively-attached component from a circuit board assembly
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United States of America Patent
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-
Jan 10, 2023
Grant Date -
N/A
app pub date -
Nov 20, 2020
filing date -
Nov 20, 2020
priority date (Note) -
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Abstract
Apparatus and associated methods relate to removing an adhesively-attached component from a circuit board assembly. A complementary pair of high-permeability members are positioned on opposite sides of the circuit board assembly about the adhesively-attached component. Then, a magnetic field is induced within the complementary pair of high permeability members via a coil driver generating an AC current in an inductive coil circumscribing a central pedestal of the complementary pair of high-permeability members. The magnetic field induced is directed through the adhesively-attached component via a central pedestal located proximate the adhesively-attached component. A return path for the magnetic field is provided about a periphery of the adhesively-attached component via a peripheral pedestal.
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