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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
YUSHIRO CHEMICAL INDUSTRY CO LTD	34-16 CHIDORI 2-CHOME OTA-KU TOKYO 1468510 ?1468510

International Classification(s)

• C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
• C10M:LUBRICATING COMPOSITIONS
• C08F:MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONL....
• B22D:CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY ....
• B22C:FOUNDRY MOULDING

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hattori, Yasuhiro	Kanagawa, JP	65	690
Morimoto, Shinsuke	Kanagawa, JP	2	0
Numata, Yasunori	Kanagawa, JP	1	0
Soga, Koji	Kanagawa, JP	2	0

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Jul 17, 2026
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jul 17, 2030
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 17, 2034

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 17, 2023	US,11554410,B2   US11554410B2	GRANTED PATENT AS SECOND PUBLICATION
December 17, 2020	US,20200391278,A1   US20200391278A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 11554410

Mold release agent composition and die casting method

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