CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same

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United States of America Patent

PATENT NO 11560495
APP PUB NO 20210230451A1
SERIAL NO

17155366

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Abstract

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A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the composition including a solvent, the solvent including a polar solvent or a non-polar solvent; an abrasive agent; and an oxidizing agent, wherein the abrasive agent includes silica modified with an amino silane that includes three nitrogen atoms.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG SDI CO LTDYONGIN-SI GYEONGGI-DO 17084

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Youn Jin Suwon-si, KR 6 7
Kim, Won Jung Suwon-si, KR 84 222
Koo, Yoon Young Suwon-si, KR 3 0
Lee, Eui Rang Suwon-si, KR 5 0
Lee, Jong Won Suwon-si, KR 190 1526
Park, Tae Won Suwon-si, KR 23 90

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