Integrated heatsink and antenna structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11563262
APP PUB NO 20210175596A1
SERIAL NO

17110744

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include heatsink portions and radio frequency antenna portions. The heatsink portions may provide a path for dissipating thermal energy or heat generated by the components in the device (e.g., printed circuit boards, processors, voltage amplifiers, etc.), and the radio frequency (RF) antenna portions may allow the device to send and receive wireless communications. The integrated heatsink and antenna structure may be formed so that radio frequency antenna portions operate to improve the thermal performance of the heatsink portions and/or so that the heatsink portions operate to improve the antenna properties (e.g., radiation patterns, radiation efficiency, bandwidth, input impedance, polarization, directivity, gain, beam-width, voltage standing wave ratio, etc.) of the radio frequency antenna portions.

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Patent Owner(s)

Patent OwnerAddress
VEEA INC164 EAST 83RD STREET NEW YORK NY 10028

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Doyle, Dave New York, US 13 27
Greaney, Shaun Joseph Freehold, US 10 20
Liccone, Michael Scotch Plains, US 16 31
Lubbe, Theodore New York, US 13 27
Migliorino, Bob Wayne, US 13 27
Mirabella, Michael New York, US 15 29
Smith, Clint New York, US 126 2919
Wintner, Perry New York, US 18 49

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