Hot-dip plating method
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United States of America Patent
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Jan 31, 2023
Grant Date -
N/A
app pub date -
Nov 6, 2019
filing date -
Nov 6, 2018
priority date (Note) -
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Abstract
Provided is a hot-dip plating method that achieves good plating wettability between a metal material and a hot-dip plating bath and that makes it possible to reduce the amount of consumed energy as compared to conventional techniques. In a plating step included in the hot-dip plating method, vibration is applied to a hot-dip plating bath such that the ratio of the average sound pressure level (excluding noise) over ranges each lying between sound pressure peaks at harmonic frequencies of a fundamental frequency to the average sound pressure level (excluding noise) over the measured frequency range in an acoustic spectrum is greater than 0.2.
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