Systems, methods and file format for 3D printing of microstructures

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United States of America Patent

PATENT NO 11567474
APP PUB NO 20210316510A1
SERIAL NO

17211633

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Abstract

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Systems, methods, and new file formats are provided for printing 3D microstructures. In some implementations, a new file format is provided that defines 3D objects by a wireframe model expressed as a collection of wires. Because wires and their parameters are defined within the new file format, objects may be processed more efficiently and quickly to support 3D rendering operations. Such methods may be used to print new articles, such as eyelashes, bushes, swabs and other novel items.

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Patent Owner(s)

Patent OwnerAddress
OPT INDUSTRIES INC85 HICKS AVENUE MEDFORD MA 02155

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ou, Jifei Cambridge, US 19 140
Schmeing, Andre Aachen, DE 6 5

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