Multilayer chip component

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United States of America Patent

PATENT NO 11568192
APP PUB NO 20210248437A1
SERIAL NO

17167694

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Abstract

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In a multilayer chip component according to an aspect of the present disclosure, dots of a two-dimensional code provided on a main surface of an element body has a semicircular cross-sectional shape. That is, since substantially no corner portions are present in a cross-sectional shape of the dots, stress is unlikely to remain when the dots are formed, and stress is unlikely to be concentrated after the dots are formed. Therefore, cracking is unlikely to occur in the foregoing multilayer chip component.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATIONTOKYO 103-6128

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Echigoya, Gaku Tokyo, JP 5 0
Ishida, Keijiro Tokyo, JP 5 0
Kudo, Hajime Tokyo, JP 12 58
Satou, Hiroshi Tokyo, JP 65 693

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